Display Panel, Manufacturing Method Thereof, and Display Apparatus

ABSTRACT

Provided are a display panel, a manufacturing method thereof and a display apparatus. The display panel includes a fingerprint identification sensor, a first light shield layer disposed on the fingerprint identification sensor and a color film layer disposed on the first light shield layer, wherein the color film layer includes color filters with different colors and light transmission parts disposed between the color filters with different colors; the first light shield layer includes first openings and light shield parts, the light transmission parts and the first openings are used for allowing fingerprint reflected light to transmit and reach the fingerprint identification sensor, and the light shield parts are used for blocking out stray light.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims the priority of Chinese PatentApplication No. 202010476642.4 filed to the CNIPA on May 29, 2020, thecontent of which is hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to, but is not limited to, the field ofdisplay technology, and particularly relates to a display panel, amethod for manufacturing the display panel, and a display apparatus.

BACKGROUND

An Organic Light Emitting Diode (OLED) is an active light emittingdisplay device, and has advantages of self-emission, wide view angle,high contrast, low power consumption, extremely high response speed,etc. With the continuous development of display technology, the OLEDtechnology is increasingly applied in flexible display apparatuses.

With the large-scale application of 5G, there is a high demand forelectronic devices to reduce the power consumption of screens, and CF onEncapsulation (COE) technology has come into being. Compared withcircular polarizer, the COE technology has higher transmittance and mayreduce power consumption of OLED products. The COE technology uses blackmatrix (BM) and Color Filter (CF) as anti-reflection layers to reducethe reflection of external ambient light by reflective metal. However,fingerprint identification technology is widely used in high-end smartphones at present, especially under-screen and in-screen fingerprintidentifications have become a trend. However, the COE technology may notbe able to identify fingerprints because there is no light passingthrough the screen because of the occlusion of the black matrix.

SUMMARY

The following is a summary of the subject matter described in detail inthe present disclosure. This summary is not intended to limit theprotection scope of the claims.

The embodiment of the present disclosure provides a display panel, whichincludes a fingerprint identification sensor, a first light shield layerdisposed above the fingerprint identification sensor and a color filmlayer disposed above the first light shield layer, wherein the colorfilm layer includes color filters with different colors and a lighttransmission part disposed between the color filters with differentcolors; the first light shield layer includes a first opening and alight shield part, wherein the light transmission part and the firstopenings are used for allowing fingerprint reflected light to transmitand reach the fingerprint identification sensor, and the light shieldpart is used for blocking out stray light.

In some exemplary embodiments, the color film layer further includes afirst black matrix disposed between the color filters with differentcolors, wherein the first black matrix is provided with a secondopening, which forms the light transmission part; there is anoverlapping area between an orthographic projection of the secondopenings on the base substrate and an orthographic projection of thefingerprint identification sensor on the base substrate; and the secondopening pin-hole images a fingerprint in contact with the display panelonto the fingerprint identification sensor.

In some exemplary embodiments, the display panel further includes acover plate, and a distance between the cover plate and the secondopenings in the direction perpendicular to the display panel is greaterthan a distance between the second opening and the fingerprintidentification sensor in the direction perpendicular to the displaypanel; an aperture of the second opening is smaller than or equal tothat of the first opening.

In some exemplary embodiments, the color film layer further includes apolarizer disposed between the color filters with different colors, thepolarizer forms the light transmission part, and the first openingpin-hole images a fingerprint in contact with the display panel onto thefingerprint identification sensor.

In some exemplary embodiments, the display panel further includes acover plate, and a distance between the cover plate and the firstopening in the direction perpendicular to the display panel is greaterthan a distance between the first opening and the fingerprintidentification sensor in the direction perpendicular to the displaypanel.

In some exemplary embodiments, the display panel further includes atouch structure layer and a second black matrix layer which aresequentially stacked on the color film layer, wherein the touchstructure layer includes multiple touch electrodes; the second blackmatrix layer includes multiple second black matrices provided with thirdopenings, an orthographic projection of the second black matrices on thebase substrate covers an orthographic projection of the touch electrodeon the base substrate, and there is an overlapping area between anorthographic projection of a third opening on the base substrate and anorthographic projection of the first opening on the base substrate.

In some exemplary embodiments, the display panel includes a basesubstrate and multiple pixel units disposed in a matrix on the basesubstrate, each pixel unit includes multiple sub-pixels, and eachsub-pixel includes a drive structure layer, a first planarization layer,a first electrode, a pixel define layer, a spacer layer, an organiclight emitting layer, a second electrode and an encapsulation layer,wherein the drive structure layer is disposed on the base substrate, andthe drive structure layer in each sub-pixel includes a first thin filmtransistor; the first planarization layer is disposed on the drivestructure layer; the first electrode is disposed on the firstplanarization layer and connected to the first thin film transistor inthe drive structure layer through a via hole formed on the firstplanarization layer; the pixel define layer is disposed on the firstplanarization layer and includes multiple pixel openings and retainingwalls around the pixel openings, and the pixel openings expose the firstelectrodes.

In an exemplary embodiment, the spacer layer is disposed on a pixeldefine layer;

The organic light emitting layer is disposed on the first electrode;

The second electrode is disposed on the organic light emitting layer;and/or

The encapsulation layer is disposed on the second electrode, and aprojection of the encapsulation layer on the base substrate covers theentire base substrate.

In some exemplary embodiments, the color film layer is disposed on theencapsulation layer, and the display panel further includes a touchstructure layer disposed between the encapsulation layer and the colorfilm layer, wherein the touch structure layer includes multiple touchelectrodes, and an orthographic projection of the touch electrodes onthe base substrate does not overlap with an orthographic projection ofthe organic light emitting layer on the base substrate.

In some exemplary embodiments, a material of the retaining wall is anorganic light shield material, the first openings are disposed on theretaining wall, and the retaining wall forms the light shield part.

In some exemplary embodiments, a material of the first planarizationlayer is an organic light shield material, and the first planarizationlayer is provided with the first opening, and the first planarizationlayer forms the light shield part.

In some exemplary embodiments, the drive structure layer includes abuffer layer, an active layer, a first gate insulating layer, a firstgate electrode layer, a second gate insulating layer, a second gateelectrode layer, a first interlayer insulating layer, a firstsource-drain metal layer, a second interlayer insulating layer and asecond source-drain metal layer sequentially stacked on the basesubstrate, wherein the second source-drain metal layer is provided withthe first openings and forms the first light shield layer.

In some exemplary embodiments, the drive structure layer includes abuffer layer, an active layer, a first gate insulating layer, a firstgate electrode layer, a second gate insulating layer, a second gateelectrode layer, a first interlayer insulating layer and a firstsource-drain metal layer which are sequentially stacked on the basesubstrate, and the first light shield layer is disposed between the basesubstrate and the buffer layer.

In some exemplary embodiments, the base substrate includes a first basesubstrate and a second base substrate, and the first light shield layeris disposed between the first base substrate and the second basesubstrate.

In some exemplary embodiments, a base film is provided on a surface ofthe base substrate away from the drive structure layer, and thefingerprint identification sensor is attached to a surface of the basefilm away from the base substrate.

In some exemplary embodiments, the fingerprint identification sensor isdisposed between the drive structure layer and the first planarizationlayer, and the drive structure layer further includes a second thin filmtransistor for turning on or off the fingerprint identification sensor.

In some exemplary embodiments, the display panel further includes afilter layer, which is disposed above the fingerprint identificationsensor and on the path where the fingerprint reflected light reaches thefingerprint identification sensor through the first opening.

In some exemplary embodiments, the filter layer is disposed on the lighttransmission part between the color filters with different colors, orthe spacer layer includes a filter material with a first color as thefilter layer, and the filter material with the first color is used forfiltering out the light that interferes with the fingerprint reflectedlight.

An embodiment of the present disclosure further provides a displayapparatus, including any one of the above display panels.

An embodiment of the present disclosure further provides a manufacturingmethod of a display panel, which includes: forming a first light shieldlayer above a base substrate, wherein the first light shield layerincludes a first opening and a light shield part; forming a color filmlayer above the first light shield layer, wherein the color film layerincludes color filters with different colors and a light transmissionpart disposed between the color filters with different colors; the lighttransmission part and the first opening are used for allowingfingerprint reflected light to transmit and reach a fingerprintidentification sensor; and the light shield part is used for blockingout stray light; attaching a fingerprint identification sensor below thebase substrate.

An embodiment of the present disclosure further provides a manufacturingmethod of a display panel, which includes: forming a drive structurelayer above a base substrate; forming a fingerprint identificationsensor on a surface of the drive structure layer away from the basesubstrate; forming a first light shield layer above the fingerprintidentification sensor, wherein the first light shield layer includes afirst opening and a light shield part; forming a color film layer abovethe first light shield layer, wherein the color film layer includescolor filters with different colors and a light transmission partdisposed between the color filters with different colors, the lighttransmission part and the first opening are used for allowingfingerprint reflected light to transmit and reach the fingerprintidentification sensor, and the light shield part is used for shieldingstray light.

Of course, an implementation of any product or method in the embodimentsof the present disclosure does not need to achieve all the advantagesmentioned above at the same time. Other features and advantages of thepresent disclosure will be set forth in the following embodiment of thedescription, and in part will become apparent from the embodiment of thedescription, or be learned by practice of the present disclosure.Purposes and other advantages of the technical solutions of the presentdisclosure may be achieved and acquired by structures specified in thedescription and drawings.

Other aspects will become apparent upon reading and understandingaccompanying drawings and the detailed description.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings are used to provide a further understanding ofthe technical solution of the present disclosure, and constitute a partof the specification. They are used together with the embodiments of thepresent application to explain the technical solution of the presentdisclosure, and do not constitute a restriction on the technicalsolution of the present disclosure. Shapes and sizes of the componentsin the accompanying drawings do not reflect true scales and are onlyused to schematically illustrate contents of the present disclosure.

FIG. 1 is a first schematic diagram of a structure of a display panelaccording to a first embodiment of the present disclosure;

FIG. 2 is a second schematic diagram of a structure of a display panelaccording to the first embodiment of the present disclosure;

FIG. 3 is a third schematic diagram of a structure of a display panelaccording to the first embodiment of the present disclosure;

FIG. 4 is a fourth schematic diagram of a structure of a display panelaccording to the first embodiment of the present disclosure;

FIG. 5 is a fifth schematic diagram of a structure of a display panelaccording to the first embodiment of the present disclosure;

FIG. 6 is a schematic diagram after a pattern of a flexible basesubstrate is manufactured according to an embodiment of the presentdisclosure;

FIG. 7 is a schematic diagram after a pattern of a drive structure layeris manufactured according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram after a pattern of a first planarizationlayer is formed according to an embodiment of the present disclosure;

FIG. 9 is a schematic diagram after a pattern of a first electrode isformed according to an embodiment of the present disclosure;

FIG. 10 is a schematic diagram after a pattern of a pixel define layeris formed according to an embodiment of the present disclosure.

FIG. 11 is a schematic diagram after a pattern of a spacer layer isformed according to an embodiment of the present disclosure;

FIG. 12 is a schematic diagram after a pattern of a second electrode isformed according to an embodiment of the present disclosure;

FIG. 13 is a schematic diagram after a pattern of an encapsulation layeris formed according to an embodiment of the present disclosure.

FIG. 14 is a schematic diagram after a pattern of a touch structurelayer is formed according to an embodiment of the present disclosure;

FIG. 15 is a schematic diagram after a pattern of a color film layer isformed according to an embodiment of the present disclosure;

FIG. 16 is a schematic diagram after a cover plate is attached accordingto an embodiment of the present disclosure;

FIG. 17 is a schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 18 is a first schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 19 is a second schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 20 is a third diagram of a structure of a display panel accordingto another embodiment of the present disclosure;

FIG. 21 is a fourth schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 22 is a fifth schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 23 is a first schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 24 is a second schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 25 is a first schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 26 is a second schematic diagram of a structure of a display panelaccording to another embodiment of the present disclosure;

FIG. 27 is a schematic flow chart of a method for manufacturing adisplay panel according to another embodiment of the present disclosure.

DETAILED DESCRIPTION

Specific implementations of the present disclosure will be described infurther detail below with reference to the accompanying drawings andembodiments. The following embodiments serve to illustrate the presentdisclosure, but are not intended to limit the scope of the presentdisclosure. It should be noted that embodiments in the presentdisclosure and features in the embodiments may be combined with eachother arbitrarily if there is no conflict.

An embodiment of the present disclosure provides a display panel, whichincludes a fingerprint identification sensor, a first light shield layerdisposed on the fingerprint identification sensor and a color film layerdisposed on the first light shield layer, wherein the color film layerincludes color filters with different colors and a light transmissionpart disposed between the color filters with different colors. The firstlight shield layer includes a first opening and a light shield part,wherein the light transmission part and the first opening are used forallowing fingerprint reflected light to transmit and reach thefingerprint identification sensor, and the light shield part is used forblocking out stray light. The stray light in the embodiments of thepresent disclosure includes stray light reflected by a touch electrodein a touch structure layer from light emitted by an organic lightemitting layer.

According to the display panel provided in the embodiment of the presentdisclosure, stray light is blocked out by the light shield part, andfingerprint reflected light is allowed to transmit and reach thefingerprint identification sensor through the light transmission partsand the first openings, so that light may pass through the screen forperforming fingerprint identification without increasing powerconsumption, thus the display panel has simple manufacturing process andhigh production efficiency, with advantages such as low production costand high yield, and has a great application prospect.

The display panel of the embodiment of the present disclosure may beimplemented by various solutions. The following will be described indetail by embodiments.

In an embodiment of the present disclosure, FIGS. 1 to 5 are schematicdiagrams of five structures of a display panel according to anembodiment of the present disclosure. A main structure of the displaypanel of the present embodiment includes multiple pixel units disposedin a matrix, wherein each pixel unit includes multiple sub-pixels. Forexample, each pixel unit may include three sub-pixels, namely a redsub-pixel R, a green sub-pixel G and a blue sub-pixel B. In the presentembodiment, a second opening K2 is disposed on a first black matrix 30between color filters 31 with different colors, and a fingerprint incontact with the display panel is pin-hole imaged onto a fingerprintidentification sensor 35 through the second opening K2. Pin-hole imagingis a physical phenomenon. When a plate with a pin hole is used to shieldbetween a wall and an object, an inverted image of the object will beformed on the wall, and such phenomenon is called pin-hole imaging.

As shown in FIGS. 1 to 5, the display panel of the present embodimentincludes a base substrate 10 and multiple pixel units disposed in amatrix on the base substrate 10, wherein each pixel unit includesmultiple sub-pixels, and each sub-pixel includes a drive structure layer401, a first planarization layer 19, a first electrode 20, a pixeldefine layer 21, a spacer layer 22, an organic light emitting layer 23,a second electrode 24 and an encapsulation layer 25.

Herein, the drive structure layer 401 is disposed on the base substrate10, and the drive structure layer 401 in each sub-pixel includes a firstthin film transistor. The first planarization layer 19 is disposed onthe drive structure layer 401. The first electrode 20 is disposed on thefirst planarization layer 19 and connected to the first thin filmtransistor in the drive structure layer 401 through a via hole providedon the first planarization layer 19. The pixel define layer 21 disposedon the first planarization layer 19 includes multiple pixel openings andretaining walls around the pixel openings, wherein the pixel openingsexpose the first electrode 20. The spacer layer 22 is disposed on thepixel define layer 21. The organic light emitting layer 23 is disposedon the first electrode 20. The second electrode 24 is disposed on theorganic light emitting layer 23. The encapsulation layer 25 is disposedon the second electrode 24 and covers the entire base substrate 10. Thecolor film layer is disposed above the encapsulation layer 25.

As shown in FIG. 1 to FIG. 5, the color film layer of the presentembodiment includes color filters 31 with different colors and a firstblack matrix 30 disposed between the color filters 31 with differentcolors. The first black matrix 30 is provided with the second openingK2, there is an overlapping area between an orthographic projection ofthe second openings K2 on the base substrate 10 and an orthographicprojection of the fingerprint identification sensor 35 on the basesubstrate 10, and the second opening K2 pin-hole images a fingerprint incontact with the display panel onto the fingerprint identificationsensor 35, and the second openings K2 form a light transmission partLTP.

As shown in FIGS. 1 to 5, the display panel of the present embodimentfurther includes a cover plate 34. In an exemplary embodiment, adistance between the cover plate 34 and the second opening K2 in adirection perpendicular to the display panel is greater than a distancebetween the second opening K2 and the fingerprint identification sensor35 in the direction perpendicular to the display panel. Since a distancebetween the second opening K2 and an outermost side of a screen is anobject distance, and the distance between the second opening K2 and thefingerprint identification sensor 35 is an image distance, the imagingarea may be increased and the density and number of pinhole arrays maybe reduced when the object distance is greater than the image distance.

In an exemplary embodiment, in order to increase the distance betweenthe cover plate 34 and the second openings K2 in the directionperpendicular to the display panel, the cover plate 34 may be made intoa multilayer structure. For example, the cover plate 34 may be made intoa double-layer structure.

In an exemplary embodiment, a shape of the first openings K1 and/or thesecond openings K2 may be square, circle, polygonal, etc.

In an exemplary embodiment, an aperture of the first opening K1 and/orthe second opening K2 may be 3 to 30 microns.

In an exemplary embodiment, an aperture of the second opening K2 issmaller than or equal to an aperture of the first opening K1 to avoid adecrease of the imaging area.

As shown in FIG. 1 to FIG. 5, the display panel of the presentembodiment further includes a touch structure layer 402, wherein thetouch structure layer 402 is disposed between the encapsulation layer 25and the color film layer. The touch structure layer 402 includesmultiple touch electrodes (MT in FIGS. 1 to 5 is an abbreviation ofMetal, while in the present disclosure, MT stands for a touchelectrode), and an orthographic projection of the first black matrix 30on the base substrate 10 includes an orthographic projection of thetouch electrode on the base substrate 10.

In an exemplary embodiment, as shown in FIG. 1, a material of theretaining wall is an organic light shield material, and the retainingwall is provided with the first opening K1, and the retaining wall formsthe light shield part (LSP). A material of the first planarization layer19 in FIG. 1 is an organic light-transmitting material.

In another exemplary embodiment, as shown in FIG. 2, the material of thefirst planarization layer 19 is an organic light shield material, andthe first planarization layer 19 provided with the first opening K1forms the light shield part (LSP). A material of the retaining wall inFIG. 2 is an organic light-transmitting material.

In another exemplary embodiment, as shown in FIG. 3, the drive structurelayer 401 includes a buffer layer 11, an active layer 12, a first gateinsulating layer 13, a first gate electrode layer 14, a second gateinsulating layer 15, a second gate electrode layer 16, a firstinterlayer insulating layer 17, a first source-drain metal layer 18, asecond interlayer insulating layer 38 and a second source-drain metallayer 39 which are sequentially stacked on the base substrate 10,wherein the second source-drain metal layer 39 is provided with thefirst opening K1 and the second source-drain metal layer 39 forms thefirst light shield layer.

In another exemplary embodiment, as shown in FIG. 4, the drive structurelayer 401 includes the buffer layer 11, the active layer 12, the firstgate insulating layer 13, the first gate electrode layer 14, a secondgate insulating layer 15, the second gate electrode layer 16, the firstinterlayer insulating layer 17 and a first source drain metal layer 18which are sequentially stacked on a base substrate 10, and a lightshield layer 40 disposed between the base substrate 10 and the bufferlayer 11 forms the first light shield layer.

In another exemplary embodiment, as shown in FIG. 5, the base substrate10 includes a first base substrate 101 and a second base substrate 102,and the light shield layer 40 disposed between the first base substrate101 and the second base substrate 102 forms the first light shieldlayer.

In the present embodiment, the first light shield layers in FIGS. 3 to 5are all made of a metal material.

In an exemplary embodiment, as shown in FIGS. 1 to 5, a base film 2 isprovided on a surface of the base substrate 10 away from the drivestructure layer 401, and the fingerprint identification sensor 35 isattached to a surface of the side of the base film 2 away from the basesubstrate 10.

In an exemplary embodiment, the fingerprint identification sensor 35 maybe a Charge Coupled Device (CCD) image sensor, a Complementary MetalOxide Semiconductor (CMOS) image sensor, or a Positive IntrinsicNegative (PIN)-type photoelectric sensor manufactured by an amorphoussilicon process.

The technical solution of the present embodiment is further describedbelow through a manufacturing process of the display panel in thepresent embodiment. A “patterning process” mentioned in the embodimentincludes processing such as film layer deposition, photoresist coating,mask exposure, development, etching, and photoresist stripping, etc. A“photolithography process” in the present embodiment includes processingsuch as film layer coating, mask exposure and development, etc. Thedeposition may be selected as any one or more of sputtering, evaporationand chemical vapor deposition, the coating may be selected as any one ormore of spraying and spin coating, and the etching may be selected asany one or more of dry etching and wet etching. A “thin film” refers toa layer of thin film manufactured from a certain material on a basesubstrate by using a deposition or coating process. If the “thin film”does not need a patterning process during the entire manufacturingprocess, the “thin film” may also be called a “layer”. When the “thinfilm” needs a patterning process during the entire manufacturingprocess, it is called a “thin film” before the patterning process andcalled a “layer” after the patterning process. The “layer” after thepatterning process includes at least one “pattern”. In the presentdisclosure, “A and B are disposed on the same layer” means that A and Bare formed at the same time by the same patterning process. “Anorthographic projection of A includes an orthographic projection of B”means that the orthographic projection of B falls within a range of theorthographic projection of A, or the orthographic projection of A coversthe orthographic projection of B.

A flexible base substrate 10 is manufactured on a glass carrier plate 1.In the present disclosure, a material of the flexible base substrate 10may be polyimide (PI), polyethylene terephthalate (PET) or asurface-treated polymer soft film, etc, which is as shown in FIG. 6.

A pattern of a drive structure layer 401 is manufactured on the flexiblebase substrate 10. The drive structure layer 401 includes multiple gatelines and multiple data lines, and the multiple gate lines and themultiple data lines vertically intersect with each other to definemultiple pixel units disposed in a matrix, each pixel unit includes atleast three sub-pixels, and each sub-pixel includes at least one firstThin Film Transistor (TFT). The first thin film transistor may have abottom gate structure or a top gate structure, or may be an amorphoussilicon (a-Si) thin film transistor, a low temperature polysilicon(LTPS) thin film transistor or an oxide thin film transistor, which isnot specifically limited here. In the present embodiment, one pixel unitincludes three sub-pixels, namely red sub-pixel R, green sub-pixel G andblue sub-pixel B. Indeed, the present embodiment is also applicable to acase where one pixel unit includes four sub-pixels (red sub-pixel R,green sub-pixel G, blue sub-pixel B and white sub-pixel W). In anexemplary embodiment, the manufacturing process of the drive structurelayer 401 may include:

A first insulating thin film and an active layer thin film aresequentially deposited on the flexible base substrate 10, the activelayer thin film is patterned by a patterning process to form a firstinsulating layer 11 covering the entire flexible base substrate 10 and apattern of an active layer 12 disposed on the first insulating layer 11.In an exemplary embodiment, the first insulating layer 11 is called abuffer layer, which is used for improving the water and oxygenresistance of the base substrate.

Then, a second insulating thin film and a first metal thin film aresequentially deposited, and the first metal thin film is patterned by apatterning process to form a second insulating layer 13 covering apattern of the active layer pattern 12 and to form a pattern of a firstgate electrode layer 14 disposed on the second insulating layer 13,wherein the first gate electrode layer 14 at least includes a first gateelectrode (GT) a first capacitor electrode (GT1), multiple gate lines(not shown) and multiple gate leads (not shown). In an exemplaryembodiment, the second insulating layer 13 is called a first gateinsulating layer (GI1).

Then, a third insulating thin film and a second metal thin film aresequentially deposited, and the second metal thin film is patterned by apatterning process to form a third insulating layer 15 covering thefirst gate electrode layer 14 and to form a pattern of a second gateelectrode layer 16 disposed on the third insulating layer 15, whereinthe second gate electrode layer 16 includes at least a second capacitorelectrode (GT2) and a second leads (not shown), wherein a position ofthe second capacitor electrode (GT2) corresponds to that of the firstcapacitor electrode (GT1). In an exemplary embodiment, the thirdinsulating layer 15 is also called a second gate insulating layer (GI2).

Then, a fourth insulating thin film is deposited and patterned by apatterning process to form a pattern of a fourth insulating layer 17covering the second gate electrode layer 16, wherein the fourthinsulating layer 17 is provided thereon with multiple first via holes,and positions of the multiple first via holes correspond to that of bothends of a first active layer. The fourth insulating layer 17, the thirdinsulating layer 15 and the second insulating layer 13 in the multiplefirst via holes are etched off to respectively expose a surface of thefirst active layer. In an exemplary embodiment, the fourth insulatinglayer 17 is also called a first interlayer insulating layer (ILD).

Then, a third metal thin film is deposited and patterned by thepatterning process to form a pattern of a source-drain metal layer 18 onthe fourth insulating layer 17, and the source-drain metal layer 18 atleast includes a first source electrode S, a first drain electrode D,low voltage line (VSS, not shown), pattern of multiple data lines (notshown), and pattern of multiple data leads (not shown), wherein thefirst source electrode S and the first drain electrode D are connectedto the active layer 12 respectively through the first via holes. In anexemplary embodiment, according to actual needs, the source-drain metallayer 18 may also include any one or more of a power supply line (VDD),a compensation line and an auxiliary second electrode, and thesource-drain metal layer 18 is also called a first source-drain metallayer (SD 1).

At this point, the pattern of the drive structure layer 401 ismanufactured on the flexible base substrate 10, as shown in FIG. 7. Theactive layer 12, the first gate electrode GT, the first source electrodeS and the first drain electrode D form the first thin film transistor,the first capacitor electrode GT1 and the second capacitor electrode GT2constitute a first storage capacitor, and multiple gate leads and dataleads form drive leads of gate driver on array (GOA).

A first planarization thin film is coated on the flexible base substratewhere the above patterns are formed to form a first planarization (PLN)layer 19 covering the entire flexible base substrate 10, a second viahole is formed on the first planarization layer 19 through a patterningprocess, wherein the first planarization layer 19 in the second via holeis etched off to expose a surface of the first drain electrode of thefirst thin film transistor, as shown in FIG. 8.

A transparent conductive thin film is deposited on the base substratewhere the above patterns are formed, and the transparent conductive thinfilm is patterned through a patterning process to form a pattern of afirst electrode 20, wherein the first electrode 20 is connected to thefirst drain electrode D through the second via hole. Forming the patternof the first electrode 20 includes depositing a fourth metal thin filmon the base substrate where the above patterns are formed, coating alayer of photoresist on the fourth metal thin film, exposing thephotoresist with a single tone mask, forming an unexposed area at theposition of the first electrode 20, forming fully exposed areas at otherpositions, developing and removing the photoresist in the fully exposedareas, etching off the fourth metal film in the fully exposed areas, andstripping off the photoresist to form the pattern of the first electrode20, as shown in FIG. 9. Since the display panel of the presentembodiment has a top emission structure, the first electrode 20 is areflective electrode, and metals with high reflectivity, such as silverAg, gold Au, palladium Pd, platinum Pt, etc., or alloys of these metals,or composite layers of these metals may be used. In practice, acomposite layer structure of indium tin oxide (ITO) layer and metalreflective layer may also be used, which has good conductivity, highreflectivity and good morphological stability.

A pixel define thin film is coated on the base substrate where the abovepatterns are formed, and a pattern of a pixel define layer (PDL) 21 isformed through masking, exposure and development processes, wherein thepixel define layer 21 is provided thereon with pixel openings, and thepixel define thin film in the pixel openings is developed away to exposea surface of the first electrode 20. The pixel define layer 21 isprovided with a first opening K1, and the pixel define thin film in thefirst opening K1 is developed to expose a surface of the firstplanarization layer 19, as shown in FIG. 10.

An organic material thin film is coated on the base substrate where theabove patterns are formed, and a pattern of a spacer (PS) layer 22 isformed through masking, exposure and development processes, wherein thespacer layer 22 is disposed at the position of the first opening K1, asshown in FIG. 11.

An organic light emitting layer 23 and a second electrode 24 aresequentially formed on the base substrate where the above patterns areformed, as shown in FIG. 12. The organic light emitting layer 23includes a hole injection layer, a hole transmission layer, a lightemitting layer, an electron transmission layer and an electron injectionlayer which are stacked, and is formed in the pixel opening to achieve aconnection between the organic light emitting layer 23 and the firstelectrode 20. Since the first electrode 20 is connected to a first drainelectrode D of the first transistor, light emission control of theorganic light emitting layer 23 is achieved. The second electrode 24 isconnected to the organic light emitting layer 23.

A pattern of an encapsulation layer 25 is formed on the base substratewhere the above patterns are formed, as shown in FIG. 13, theencapsulation layer 25 may adopt a laminated structure of inorganicmaterial/organic material/inorganic material, wherein the organicmaterial layer is disposed between two inorganic material layers.

A pattern of a touch structure layer 402 is formed on the base substratewhere the above patterns are formed, and the touch structure layer 402includes a first touch electrode layer 26, a fifth insulating layer 27,a second touch electrode layer 28 and a sixth insulating layer 29stacked on the encapsulation layer 25, as shown in FIG. 14.

A pattern of a color film layer is formed on the base substrate wherethe above patterns are formed, wherein the color film layer is disposedon the sixth insulating layer 29 and includes a first black matrix 30and a color filter 31 disposed on a same layer, as shown in FIG. 15.Forming the pattern of the color filter layer includes: firstly, coatinga polymer photoresist layer mixed with black matrix material on thesixth insulating layer 29 to form a pattern of the first black matrix 30through exposure and development; then, coating a polymer photoresistlayer mixed with red pigment on the sixth insulating layer 29 to form apattern of a red area through exposure and development; sequentiallyforming a pattern of a green area and a pattern of a blue area using thesame methods and steps; and finally, forming color filters 31 with red,green and blue which are arranged according to a certain rule. Thesecond opening K2 is disposed on the first black matrix 30 between thecolor filters 31 with different colors, and the second opening K2exposes a surface of the sixth insulating layer 29.

A thin film encapsulation process is performed on the base substratewhere the above patterns are formed to form a pattern of a coatingprotective layer 32, an optical adhesive 33 is coated on the basesubstrate where the pattern of the coating protective layer 32 isformed, and a cover plate 34 is attached to the optical adhesive 33, asshown in FIG. 16.

After the above film structure is manufactured, a display substrate ispeeled off from a glass carrier plate 1 by peeling process, and then abase film 2 is attached to the back of the display substrate (a surfaceof the flexible base substrate 10 away from the film layer) by rollerbonding, and a fingerprint identification sensor 35 is attached to asurface of the base film 2 away from the flexible base substrate 10, thefingerprint identification sensor 35 is attached to the surface of thebase film 2 on the side away from the flexible base substrate 10 througha foam layer 36 and the fingerprint identification sensor 35 isconnected to a flexible printed circuit (FPC) 37, as shown in FIG. 1.

Through the above process, the manufacturing of the display panel shownin FIG. 1 in the present embodiment can be completed. It may be seenfrom the above manufacturing process that the display panel according tothe present embodiment blocks out stray light through the light shieldpart LSP, and allows fingerprint reflected light to transmit and reachthe fingerprint identification sensor 35 through the light transmissionpart LTP and the first opening K1, so that light can pass through thescreen for fingerprint identification without increasing powerconsumption. The manufacturing process is simple and the productionefficiency is high with the advantages of low production cost, highyield, etc, which has a great application prospect.

Although the display panel of the present embodiment is described with atop emission structure, the solution of the present embodiment isapplicable to a bottom emission structure or a double-sided emissionstructure, and is also applicable to large-sized or small-sized displaypanels. As shown in FIG. 1, the display panel manufactured by the abovemanufacturing process includes:

a base substrate 10;

a drive structure layer 401 disposed on the base substrate 10, whereinthe drive structure layer 401 in each sub-pixel includes a first thinfilm transistor;

a first planarization layer 19 disposed on the drive structure layer401;

a light emitting structure layer disposed on the first planarizationlayer 19, the light emitting structure layer in each sub-pixel includesa first electrode 20, a pixel define layer 21, a spacer layer 22, anorganic light emitting layer 23 and a second electrode 24, wherein thefirst electrode 20 is disposed on the first planarization layer 19 andconnected to the first thin film transistor in the drive structure layer401 through a via hole provided on the first planarization layer 19, andthe pixel define layer 21 is disposed on the first planarization layer19 and includes multiple pixel openings and retaining walls around thepixel openings, wherein the pixel openings expose the first electrode20, a material of the retaining walls is an organic light shieldmaterial, and first openings K1 are provided on the retaining walls; thespacer layer 22 is disposed on the pixel define layer 21; the organiclight emitting layer 23 is disposed on the first electrode 20; thesecond electrode 24 is disposed on the organic light emitting layer 23;

an encapsulation layer 25 disposed on the second electrode 24 andcovering the entire base substrate 10;

a touch structure layer 402 including a first touch electrode layer 26,a fifth insulating layer 27, a second touch electrode layer 28 and asixth insulating layer 29 which are stacked on the encapsulation layer25;

a color film layer disposed on the sixth insulating layer 29, includinga black matrix 30 and color filters 31 disposed on a same layer, whereinthe second opening K2 is disposed on the black matrix 30 between thecolor filters 31 with different colors, and the second opening K2 exposea surface of the sixth insulating layer 29;

-   -   a coating protective layer 32 disposed on the color film layer        for protecting the color film layer;

a cover plate 34 attached to the coating protective layer 32 by anoptical adhesive 33;

a base film 2 disposed on a surface of the base substrate 10 away fromthe drive structure layer 401; and

the fingerprint identification sensor 35 attached to a surface of thebase film 2 away from the base substrate 10.

The manufacturing process of the display panel shown in FIG. 2 to FIG. 5is similar to this, and thus the repeated contents will not be describedin the present disclosure.

In another embodiment of the present disclosure, the present embodimentis an extension of the aforementioned embodiments. In the aforementionedembodiments, the touch structure layer 402 in FIGS. 1 to 5 is disposedbetween the encapsulation layer 25 and the color film layers, and in thepresent embodiment, the touch structure layer 402 is disposed above thecolor film layers. As shown in FIG. 17, the display panel provided inthe present embodiment includes multiple pixel units disposed in amatrix, and each pixel unit includes multiple sub-pixels, for example,each pixel unit may include three sub-pixels, namely red sub-pixel R,green sub-pixel G and blue sub-pixel B. In the present embodiment, thedisplay panel is provided with a second black matrix layer on the touchstructure layer 402, wherein the second black matrix layer includesmultiple second black matrices 41 with third openings K3. Anorthographic projection of the second black matrices 41 on the basesubstrate 10 covers an orthographic projection of touch electrodes onthe base substrate 10, and the stray light caused by the reflection ofthe touch electrodes is eliminated by the second black matrices 41.

As shown in FIG. 17, the display panel of the present embodimentincludes the base substrate 10 and multiple pixel units disposed in amatrix on the base substrate 10. Each pixel unit includes multiplesub-pixels, and each sub-pixel includes a drive structure layer 401, afirst planarization layer 19, a first electrode 20, a pixel define layer21, a spacer layer 22, an organic light emitting layer 23, a secondelectrode 24, an encapsulation layer 25, a color film layer and acoating protective layer 32.

Herein, the drive structure layer 401 is disposed on the base substrate10 and the drive structure layer 401 in each sub-pixel includes a firstthin film transistor. The first planarization layer 19 is disposed onthe drive structure layer 401. The first electrode 20 is disposed on thefirst planarization layer 19 and connected to the first thin filmtransistor in the drive structure layer 401 through a via hole providedon the first planarization layer 19. The pixel define layer 21 isdisposed on the first planarization layer 19 and includes multiple pixelopenings and retaining wall around the pixel openings, wherein the pixelopenings expose the first electrodes 20. The spacer layer 22 is disposedon the pixel define layer 21. The organic light emitting layer 23 isdisposed on the first electrode 20. The second electrode 24 is disposedon the organic light emitting layer 23; the encapsulation layer 25 isdisposed on the second electrode 24 and covers the entire base substrate10. The color film layer is disposed on the encapsulation layer 25. Thecoating protective layer 32 is disposed on the color film layer.

As shown in FIG. 17, the display panel of the present embodiment furtherincludes a touch structure layer 402 and the second black matrix layersequentially stacked on the coating protective layer 32, among them:

the touch structure layer 402 includes multiple touch electrodes;

the second black matrix layer includes multiple second black matrices 41provided with third openings K3. An orthographic projection of thesecond black matrices 41 on the base substrate 10 covers an orthographicprojection of the touch electrodes on the base substrate 10, and thereis an overlapping area between an orthographic projection of the thirdopenings K3 on the base substrate 10 and an orthographic projection ofthe second openings K2 on the base substrate 10.

Similar to the principle of the aforementioned embodiments, the firstlight shield layer of the present embodiment may be an opaque organicmaterial layer, which may be disposed on the first planarization layer19 or the pixel define layer 21. Alternatively, the first light shieldlayer in the present embodiment may also be made of a metal layer, whichmay be disposed at any one of the following positions: on a secondsource-drain metal layer 39. between the base substrate 10 and a bufferlayer 11, and between a first base substrate 101 and a second basesubstrate 102.

The present embodiment also achieves the technical effects of theaforementioned embodiments, which include blocking out stray lightthrough the light shield part LSP, allowing fingerprint reflected lightto transmit and reach the fingerprint identification sensor 35 throughthe light transmission part LTP and the first openings K1, enablinglight to pass through the screen for fingerprint identification withoutincreasing power consumption, with advantages of simple manufacturingprocess, high production efficiency, low production cost, high yield,which has a good application prospect; and providing second openings K2on the first black matrices 30 between the color filters 31 withdifferent colors, pin-hole imaging a fingerprint in contact with thedisplay panel onto the fingerprint identification sensor 35 through thesecond openings K2.

In another embodiment of the present disclosure, the present embodimentis an extension of the aforementioned embodiments. The color film layerin the aforementioned embodiments includes a first black matrix 30, andthe first black matrix 30 is provided with a second opening K2 whichforms the light transmission part LTP. The color film layer in thepresent embodiment includes a polarizer which forms the lighttransmission part LTP. As shown in FIG. 18 to FIG. 22, the display panelaccording to the present embodiment includes multiple pixel unitsdisposed in a matrix, and each pixel unit includes multiple sub-pixels.For example, each pixel unit may include three sub-pixels, namely redsub-pixel R, green sub-pixel G and blue sub-pixel B. The color filmlayer of the display panel of the present embodiment includes colorfilters 31 with different colors and a polarizer 42 disposed between thecolor filters 31 with different colors, wherein the polarizer 42 formsthe light transmission part LTP, and a fingerprint in contact with thedisplay panel is pin-hole imaged on a fingerprint identification sensor35 through the first opening K1.

As shown in FIGS. 18 to 22, the display panel includes a base substrate10, a drive structure layer 401, a first planarization layer 19, a firstelectrode 20, a pixel define layer 21, a spacer layer 22, an organiclight emitting layer 23, a second electrode 24, an encapsulation layer25, a touch structure layer 402, a color film layer, a coatingprotective layer 32 and a cover plate 34 which are disposed on the basesubstrate 10.

The drive structure layer 401 is disposed on the base substrate 10 andthe drive structure layer 401 in each sub-pixel includes a first thinfilm transistor. The first planarization layer 19 is disposed on thedrive structure layer 401. The first electrode 20 is disposed on thefirst planarization layer 19 and connected to the first thin filmtransistor in the drive structure layer 401 through a via hole providedon the first planarization layer 19. The pixel define layer 21 isdisposed on the first planarization layer 19 and includes multiple pixelopenings and retaining walls around the pixel openings, wherein thepixel openings expose the first electrodes 20. The spacer layer 22 isdisposed on the pixel define layer 21. The organic light emitting layer23 is disposed on the first electrode 20. The second electrode 24 isdisposed on the organic light emitting layer 23. The encapsulation layer25 is disposed on the second electrode 24 and covers the entire basesubstrate 10. The touch structure layer 402 is disposed on theencapsulation layer 25. The color film layer is disposed on the touchstructure layer 402. The coating protective layer 32 is disposed on thecolor film layer. The cover plate 34 is disposed on the coatingprotective layer 32.

In the present embodiment, the color film layer includes color filters31 with different colors and a polarizer 42 disposed between the colorfilters 31 with different colors, wherein the polarizer 42 forms thelight transmission part LTP, and the first opening K1 pin-hole images afingerprint in contact with the display panel onto the fingerprintidentification sensor 35.

In an exemplary embodiment, as shown in FIGS. 7 to 11, the display panelfurther includes a cover plate 34, and a distance between the coverplate 34 and first opening K1 in the direction perpendicular to thedisplay panel is greater than a distance between the first opening K1and the fingerprint identification sensor 35 in the directionperpendicular to the display panel. Since the distance between the firstopening K1 and an outermost side of a screen is an object distance, andthe distance between the first opening K1 and the fingerprintidentification sensor 35 is an image distance, the imaging area may beincreased and the density and number of pinhole arrays may be reducedwhen the object distance is greater than the image distance.

In an exemplary embodiment, in order to increase the distance betweenthe cover plate 34 and the first opening K1 in the directionperpendicular to the display panel, the cover plate 34 may be made intoa multilayer structure. For example, the cover plate 34 may be made intoa double-layer structure.

In an exemplary embodiment, a shape of the first opening K1 may besquare, circle, polygonal, etc.

In an exemplary embodiment, an aperture of the first opening K1 may be 3to 30 microns. A first light shield layer in the present embodiment maybe an opaque organic material layer, which may be disposed on a firstplanarization layer 19 or a pixel define layer 21. Alternatively, thefirst light shield layer in the present embodiment may also be made of ametal layer, which may be disposed at any one of the followingpositions: on a second source-drain metal layer 39, between the basesubstrate 10 and a buffer layer 11, and between a first base substrate101 and a second base substrate 102.

In an exemplary embodiment, as shown in FIG. 18, the material of aretaining wall is an organic light shield material, and the retainingwall is provided with a first opening K1, and the retaining wall formsthe light shield part LSP.

In another exemplary embodiment, as shown in FIG. 19, a material of thefirst planarization layer 19 is an organic light shield material, thefirst planarization layer 19 is provided thereon with the first openingK1, and the first planarization layer 19 forms the light shield partLSP.

In still another exemplary embodiment, as shown in FIG. 20, a drivestructure layer 401 includes a buffer layer 11, an active layer 12, afirst gate insulating layer 13, a first gate electrode layer 14, asecond gate insulating layer 15, a second gate electrode layer 16, afirst interlayer insulating layer 17, a first source-drain metal layer18, a second interlayer insulating layer 38 and a second source-drainmetal layer 39 which are sequentially stacked on a base substrate 10,wherein the second source-drain metal layer 39 is provided with a firstopening K1 and the second source-drain metal layer 39 forms the firstlight shield layer.

In still another exemplary embodiment, as shown in FIG. 21, a drivestructure layer 401 includes a buffer layer 11, an active layer 12, afirst gate insulating layer 13, a first gate electrode layer, a secondgate insulating layer 15, a second gate electrode layer 16, a firstinterlayer insulating layer 17 and a first source-drain metal layer 18which are sequentially stacked on a base substrate 10, and a lightshield layer 40 disposed between the base substrate 10 and the bufferlayer 11 forms the first light shield layer.

In still another exemplary embodiment, as shown in FIG. 22, the basesubstrate 10 includes a first base substrate 101 and a second basesubstrate 102, and a light shield layer 40 disposed between the firstbase substrate 101 and the second base substrate 102 forms the firstlight shield layer.

The present embodiment also achieves the technical effects of theaforementioned embodiments, which include blocking out stray lightthrough the light shield part LSP, allowing fingerprint reflected lightto transmit and reach the fingerprint identification sensor 35 throughthe light transmission part LTP and the first opening K1, and enablinglight to pass through the screen for fingerprint identification withoutincreasing power consumption with advantages of simple manufacturingprocess, high production efficiency, low production cost and high yield,etc, which has a great application prospect. Meanwhile, in the presentembodiment, a polarizer 42 is disposed between color filters 31 withdifferent colors, and the light transmission part LTP is formed by thepolarizer 42, and a fingerprint in contact with the display panel arepin-hole imaged on the fingerprint identification sensor 35 through thefirst opening K1.

In another embodiment of the present disclosure, the present embodimentis an extension of the aforementioned embodiments. The fingerprintidentification sensor 35 in the aforementioned embodiments is disposedat the bottom of the display panel, and the fingerprint identificationsensor 35 in the present embodiment is disposed inside the displaypanel. The fingerprint identification sensor 35 of the presentembodiment may be a PIN-type photoelectric sensor 43 manufactured by anamorphous silicon process.

As shown in FIG. 23 and FIG. 24, the display panel provided in thepresent embodiment includes multiple pixel units disposed in a matrix,and each pixel unit includes multiple sub-pixels. For example, eachpixel unit may include three sub-pixels, namely red sub-pixel R, greensub-pixel G and blue sub-pixel B. In the display panel of the presentembodiment, a PIN-type photoelectric sensor 43 is provided on a drivestructure layer 401, the drive structure layer 401 includes a secondthin film transistor, and the PIN-type photoelectric sensor 43 isconnected to the second thin film transistor in the drive structurelayer 401.

As shown in FIGS. 23 and 24, the display panel includes a base substrate10, and the drive structure layer 401, a photoelectric sensor layer, afirst planarization layer 19, a first electrode 20, a pixel define layer21, a spacer layer 22, an organic light emitting layer 23, a secondelectrode 24, an encapsulation layer 25, a touch structure layer 402, acolor film layer, a coating protective layer 32 and a cover plate 34which are disposed on the base substrate 10.

The drive structure layer 401 disposed on the base substrate 10 and thedrive structure layer 401 in each sub-pixel includes a first thin filmtransistor and a second thin film transistor. The photoelectric sensorlayer is disposed on the drive structure layer 401 and includes aPIN-type photoelectric sensor 43 connected to the second thin filmtransistor in the drive structure layer 401, the second thin filmtransistor is used to turn on or off the PIN photoelectric sensor 43.The first planarization layer 19 is disposed on the photoelectric sensorlayer. The first electrode 20 is disposed on the first planarizationlayer 19 and connected to the first thin film transistor in the drivestructure layer 401 through a via hole provided on the firstplanarization layer 19. The pixel define layer 21 disposed on the firstplanarization layer 19 and includes multiple pixel openings andretaining walls around the pixel openings, wherein the pixel openingsexpose the first electrodes 20. The spacer layer 22 is disposed on thepixel define layer 21. The organic light emitting layer 23 is disposedon the first electrode 20. The second electrode 24 is disposed on theorganic light emitting layer 23. The encapsulation layer 25 disposed onthe second electrode 24 and covers the entire base substrate 10. Thetouch structure layer 402 is disposed on the encapsulation layer 25, andthe color film layer is disposed on the touch structure layer 402. Thecoating protective layer 32 is disposed on the color film layer. Thecover plate 34 is disposed on the coating protective layer 32.

As shown in FIG. 23, the color film layer includes color filters 31 withdifferent colors and a first black matrix 30 disposed between the colorfilters 31 with different colors. The first black matrix 30 is providedwith a second opening K2, there is an overlapping area between anorthographic projection of the second opening K2 on the base substrate10 and an orthographic projection of a fingerprint identification sensor35 on the base substrate 10, the second opening K2 pin-hole images afingerprint in contact with the display panel onto the fingerprintidentification sensor 35, and the second opening K2 forms the lighttransmission part LTP.

As shown in FIG. 24, the color film layer includes color filters 31 withdifferent colors and a polarizer 42 disposed between the color filters31 with different colors, the polarizer 42 forms the light transmissionpart LTP, and the first opening K1 pin-hole images a fingerprint incontact with the display panel onto the fingerprint identificationsensor 35.

A first light shield layer in the present embodiment may be an opaqueorganic material layer, which may be disposed on the first planarizationlayer 19 or the pixel define layer 21.

In an exemplary embodiment, as shown in FIG. 23, a material of theretaining walls is an organic light shield material, and a retainingwalls is provided with a first opening K1, and the retaining wall formsthe light shield part LSP.

In another exemplary embodiment, a material of the first planarizationlayer 19 is an organic light shield material, the first planarizationlayer 19 is provided with a first opening K1, and the firstplanarization layer 19 forms the light shield part LSP.

In an exemplary embodiment, a distance between the cover plate 34 andthe first opening K1 in the direction perpendicular to the display panelis greater than a distance between the first opening K1 and thefingerprint identification sensor 35 in the direction perpendicular tothe display panel.

The present embodiment also achieves the technical effects of theaforementioned embodiments, which includes blocking out stray lightthrough the light shield part LSP, allowing fingerprint reflected lightto transmit and reach the fingerprint identification sensor 35 throughthe light transmission part LTP and the first opening K1, and enablinglight to pass through the screen for fingerprint identification withoutincreasing power consumption with the advantages of simple manufacturingprocess, high production efficiency, low production cost and high yield,etc, which has a great application prospect. In the present embodiment,a pin-type photoelectric sensor 43 is disposed on a drive structurelayer 401, and a second thin film transistor disposed in the drivestructure layer 401 is used to turn on or off the pin-type photoelectricsensor 43.

In another embodiment of the present disclosure, the present embodimentis an extension of the aforementioned embodiments. A display panel ofthe present embodiment is provided with a filter layer 44 on afingerprint identification sensor 35, and the filter layer 44 isdisposed on a path where the fingerprint reflected light pass throughthe first opening K1 to reach the fingerprint identification sensor.

As shown in FIGS. 25 and 26, the display panel according to the presentembodiment includes a base substrate 10, and a drive structure layer401, a first planarization layer 19, a first electrode 20, a pixeldefine layer 21, a spacer layer 22, an organic light emitting layer 23,a second electrode 24, an encapsulation layer 25, a touch structurelayer 402, a color film layer, a coating protective layer 32 and a coverplate 34 which are disposed on the base substrate 10. The drivestructure layer 401 disposed on the base substrate 10, and the drivestructure layer 401 in each sub-pixel includes a first thin filmtransistor. The first planarization layer 19 is disposed on the drivestructure layer 401. The first electrode 20 is disposed on the firstplanarization layer 19 and connected to the first thin film transistorin the drive structure layer 401 through a via hole provided on thefirst planarization layer 19. The pixel define layer 21 is disposed onthe first planarization layer 19 and includes multiple pixel openingsand retaining walls around the pixel openings, wherein the pixelopenings expose the first electrodes 20. The spacer layer 22 is disposedon the pixel define layer 21. The organic light emitting layer 23 isdisposed on the first electrode 20. The second electrode 24 is disposedon the organic light emitting layer 23. The encapsulation layer 25 isdisposed on the second electrode 24 and covers the entire base substrate10. The touch structure layer 402 is disposed on the encapsulation layer25. The color film layer is disposed on the touch structure layer 402.The coating protective layer 32 is disposed on the color film layer. Thecover plate 34 is disposed on the coating protective layer 32.

In an exemplary embodiment, as shown in FIG. 25 and FIG. 26, a colorfilm layer includes color filters 31 with different colors and a firstblack matrix 30 disposed between the color filters 31 with differentcolors. The first black matrix 30 is provided with a second opening K2.There is an overlapping area between an orthographic projection of thesecond opening K2 on a base substrate 10 and an orthographic projectionof a fingerprint identification sensor 35 on the base substrate 10. Thesecond opening K2 pin-hole images a fingerprint in contact with thedisplay panel onto the fingerprint identification sensor 35 and thesecond opening K2 forms the light transmission part.

In an exemplary embodiment, the filter layer 44 is disposed on a lighttransmission part LTP between the color filters 31 with differentcolors.

In an exemplary embodiment, as shown in FIG. 25, the filter layer 44 isdisposed on a same layer as the color film layer, and the filter layer44 includes multiple filters with a first color, each of the multiplefilters with the first color covers one second opening K2. The filterswith the first color is used for filtering out light which interfereswith fingerprint reflected light. For example, the filters with thefirst color may filter out light (such as infrared light) that may passthrough a finger in external light.

In an exemplary embodiment, the filters with the first color are greenfilters (referring to filters that may transmit green light) or cyanfilters (referring to filters that may transmit cyan light).

Under-screen fingerprint identification uses light which is emitted byOLED and reflected by a human finger and then enters a fingerprintidentification sensor under a screen. Ridges on the finger reflect thelight differently, thus bright and dark stripes are formed. Because ahuman finger has a certain transmittance to infrared light, red light isnot emitted when the fingerprint identification is performed, instead,green light (with high luminous efficiency) is adopted or green lightand blue light are adopted. However, a human finger has a certaintransmittance to infrared light, so infrared light in external lightwill also enter the fingerprint identification sensor through thefinger, which will interference with a real fingerprint signal. In thedisplay panel of the embodiment of the present disclosure, a layer ofgreen or cyan filters are manufactured above the fingerprintidentification sensor 35, which are used to filter out infrared lighttransmitted by external light through the finger.

In another exemplary embodiment, as shown in FIG. 26, the spacer layer22 includes a filter material of a first color, and the spacer layer 22serves as the filter layer 44. The filter material of the first color isused for filtering out light which interferes with the reflected lightof a fingerprint. For example, the filter material of the first color isa green filter material (which may transmit green light) or a cyanfilter material (which may transmit cyan light).

In an exemplary embodiment, a filter layer in the present embodiment maybe placed at any position on a light path where fingerprint reflectedlight enters the fingerprint identification sensor through the firstopening K1, which is not limited in the present disclosure.

The present embodiment also achieves the technical effects of theaforementioned embodiments, which includes blocking out stray lightthrough the light shield part LSP, allowing fingerprint reflected lightto transmit and reach the fingerprint identification sensor 35 throughthe light transmission part LTP and the first opening K1, and enablinglight to pass through the screen for fingerprint identification withoutincreasing power consumption with the advantages of simple manufacturingprocess, high production efficiency, low production cost and high yield,etc, which has a great application prospect. In addition, in the presentembodiment, the filter layer 44 is disposed on the path where thefingerprint reflected light passes through the first openings K1 toreach the fingerprint identification sensor, so as to filter out theinfrared light in the external light and enhance the fingerprintidentification effect.

In another embodiment of the present disclosure, a method formanufacturing a display panel is further provided. As shown in FIG. 27,a method for manufacturing a display panel according to an embodiment ofthe present disclosure includes:

S1. forming a first light shield layer above a base substrate, whereinthe first light shield layer includes a first opening and a light shieldpart.

S2. forming a color film layer above the first light shield layer,wherein the color film layer includes color filters with differentcolors and a light transmission part disposed between the color filterswith different colors, the light transmission part and the first openingare used for allowing fingerprint reflected light to transmit and reacha fingerprint identification sensor, and the light shield part is usedfor blocking out stray light.

S3. attaching the fingerprint identification sensor below the basesubstrate.

In an exemplary embodiment, forming the first light shield layer abovethe base substrate in S1 may include any one of the following:

the base substrate including a first base substrate and a second basesubstrate, forming the first light shield layer on the first basesubstrate, and forming the second base substrate on a surface of thefirst light shield layer away from the first base substrate;

forming the first light shield layer on the base substrate, and forminga pixel structure layer on the first light shield layer;

forming a pixel structure layer on the substrate, wherein the pixelstructure layer includes a buffer layer, an active layer, a first gateinsulating layer, a first gate electrode layer, a second gate insulatinglayer, a second gate electrode layer, a first interlayer insulatinglayer, a first source-drain metal layer, a second interlayer insulatinglayer and a second source-drain metal layer which are sequentiallystacked on the base substrate and the second source-drain metal layerforms the first light shield layer;

forming a pixel structure layer on base the substrate, forming a firstplanarization layer on a surface of the pixel structure layer away fromthe base substrate, forming a first electrode and a pixel define layeron a surface of the first planarization layer away from the pixelstructure layer, wherein the pixel define layer includes multipleopenings and retaining walls around the openings, the first openingsexpose the first electrode, the retaining walls are provided with firstopenings, a material of the retaining walls is an organic light shieldmaterial, and the retaining walls form the first light shield layer; and

forming a pixel structure layer on the base substrate, and forming afirst planarization layer on a surface of the pixel structure layer awayfrom the base substrate, wherein the first planarization layer is madeof an organic light shield material and is provided with a firstopening, and the first planarization layer forms the first light shieldlayer.

In an exemplary embodiment, the color film layer includes color filterswith different colors and a first black matrix disposed between thecolor filters with different colors. Before attaching the fingerprintidentification sensor under the base substrate, the method furtherincludes:

providing the first black matrix with a second opening, there is anoverlapping area between an orthographic projection of the secondopening on a base substrate and an orthographic projection of thefingerprint identification sensor on the base substrate, and the secondopening pin-hole images a fingerprint in contact with the display panelonto the fingerprint identification sensor, and the second opening formsthe light transmission part.

In another exemplary embodiment, the color film layer includes colorfilters with different colors and a polarizer disposed between the colorfilters with different colors, the polarizer forms the lighttransmission part, and the first opening pin-hole images a fingerprintin contact with the display panel onto the fingerprint identificationsensor.

In an exemplary embodiment, before forming the color film layer abovethe first light shield layer, the method further includes:

forming a touch structure layer above the first light shield layer,wherein the touch structure layer includes multiple touch electrodes,and an orthographic projection of the touch electrodes on a basesubstrate does not overlap with an orthographic projection of an organiclight emitting layer on the base substrate.

In another exemplary embodiment, after forming the color film layerabove the first light shield layer, the method further includes:

forming a touch structure layer and a second black matrix layer abovethe color film layer, wherein the second black matrix layer includesmultiple second black matrices, and the multiple second black matricesare provided with third openings and the touch structure layer includesmultiple touch electrodes; an orthographic projection of the secondblack matrices on the base substrate covers an orthographic projectionof the touch electrodes on the base substrate, and there is anoverlapping area between an orthographic projection of the thirdopenings on the base substrate and an orthographic projection of thefirst openings on the base substrate.

In another embodiment of the present disclosure, a method formanufacturing a display panel according to an embodiment of the presentdisclosure includes:

forming a drive structure layer above a base substrate;

forming a fingerprint identification sensor on a surface of the drivestructure layer away from the base substrate;

forming a first light shield layer above the fingerprint identificationsensor, wherein the first light shield layer includes a first openingand a light shield part;

forming a color film layer above the first light shield layer, whereinthe color film layer includes color filters with different colors and alight transmission part disposed between the color filters withdifferent colors, wherein the light transmission part and the firstopening are used for allowing fingerprint reflected light to transmitand reach the fingerprint identification sensor, and the light shieldpart is used for blocking out stray light.

In the present embodiment, the structures, materials, relevantparameters and detailed manufacturing processes of display panel havebeen described in detail in the above embodiments, and will not bedescribed here again.

According to the method for manufacturing the display panel provided inthe present embodiment, stray light is blocked out by the light shieldpart, and fingerprint reflected light is allowed to transmit and reachthe fingerprint identification sensor through the light transmissionpart and the first opening, so that light may pass through the screenfor fingerprint identification without increasing power consumption withadvantages of simple manufacturing process, high production efficiency,low production cost and high yield, etc, which has a great applicationprospect.

In another embodiment of the present disclosure, a display apparatusincluding the display panel of the above-mentioned embodiments isfurther provided. The display apparatus may be any product or componentwith a display function such as a mobile phone, a tablet computer, atelevision, a display, a laptop computer, a digital photo frame, anavigator, etc.

In the description of the present disclosure, it should be understoodthat an orientation or position relationship indicated by the terms“middle”, “upper”, “lower”, “front”, “rear”, “vertical”, “horizontal”,“top”, “bottom”, “inner”, “outer” and the like is based on theorientation or position relationship shown in the accompanying drawings,which is only for the convenience of describing the present disclosureand simplifying the description, rather than indicating or implying thatthe apparatus or element referred to must have the specific orientation,or be constructed and operated in the specific orientation, and thuscannot be interpreted as a limitation on the present disclosure.

In the description of embodiments of the present disclosure, it shouldbe noted that unless otherwise clearly specified and defined, the terms“install”, “connect”, “couple” should be broadly interpreted, forexample, it may be connected fixedly or connected detachably, orintegrated; it may be a mechanical connection or an electricalconnection; it may be directly connected, or may be indirectly connectedthrough an intermediary, or may be an internal connection between twoelements. For those of ordinary skills in the art, the specific meaningsof the above terms in the present disclosure may be understood accordingto specific situations.

Although the embodiments disclosed in the present disclosure are asdescribed above, the described contents are only the embodiments forfacilitating understanding of the present disclosure, which are notintended to limit the present disclosure. A person skilled in the art towhich the present disclosure pertains may make any modifications andvariations in the form and details of implementation without departingfrom the spirit and scope of the present disclosure. Nevertheless, thescope of patent protection of the present disclosure shall still bedetermined by the scope defined by the appended claims.

What is claimed is:
 1. A display panel, comprising a fingerprintidentification sensor, a first light shield layer disposed above thefingerprint identification sensor, and a color film layer disposed abovethe first light shield layer, wherein the color film layer comprisescolor filters with different colors and a light transmission partdisposed between the color filters with different colors; the firstlight shield layer comprises a first opening and a light shield part,wherein the light transmission part and the first opening are configuredto allow fingerprint reflected light to transmit and reach thefingerprint identification sensor, and the light shield part isconfigured to block out stray light.
 2. The display panel according toclaim 1, wherein the color film layer further comprises a first blackmatrix disposed between the color filters with different colors, thefirst black matrix is provided with a second opening which forms thelight transmission part, there is an overlapping area between anorthographic projection of the second opening on the base substrate andan orthographic projection of the fingerprint identification sensor onthe base substrate, and the second opening pin-hole images a fingerprintin contact with the display panel onto the fingerprint identificationsensor.
 3. The display panel according to claim 2, further comprising acover plate, wherein a distance between the cover plate and the secondopening in a direction perpendicular to the display panel is greaterthan a distance between the second opening and the fingerprintidentification sensor in the direction perpendicular to the displaypanel; an aperture of the second opening is smaller than or equal to anaperture of the first opening.
 4. The display panel according to claim1, wherein the color film layer further comprises a polarizer disposedbetween the color filters with different colors, the polarizer forms thelight transmission part, and the first opening pin-hole images afingerprint in contact with the display panel onto the fingerprintidentification sensor.
 5. The display panel according to claim 4,further comprising a cover plate, wherein a distance between the coverplate and the first opening in a direction perpendicular to the displaypanel is greater than a distance between the first opening and thefingerprint identification sensor in the direction perpendicular to thedisplay panel.
 6. The display panel according to claim 1, furthercomprising a touch structure layer and a second black matrix layersequentially stacked on the color film layer, wherein the touchstructure layer comprises a plurality of touch electrodes; the secondblack matrix layer comprises a plurality of second black matrices withthird openings, an orthographic projection of the second black matriceson the base substrate covers an orthographic projection of the touchelectrodes on the base substrate, and there is an overlapping areabetween an orthographic projection of a third opening on the basesubstrate and an orthographic projection of the first opening on thebase substrate.
 7. The display panel according to claim 1, furthercomprising a base substrate and a plurality of pixel units disposed in amatrix on the base substrate, wherein each pixel unit comprises aplurality of sub-pixels, and each sub-pixel comprises a drive structurelayer, a first planarization layer, a first electrode and a pixel definelayer, wherein the drive structure layer is disposed on the basesubstrate, and the drive structure layer in each sub-pixel comprises afirst thin film transistor; the first planarization layer is disposed onthe drive structure layer; the first electrode is disposed on the firstplanarization layer and connected to the first thin film transistor inthe drive structure layer through a via hole provided on the firstplanarization layer; and the pixel define layer is disposed on the firstplanarization layer and comprises a plurality of pixel openings andretaining walls around the pixel openings, and the pixel openings exposethe first electrode.
 8. The display panel according to claim 7, whereineach sub-pixel further comprises a spacer layer, an organic lightemitting layer, a second electrode and an encapsulation layer, whereinthe spacer layer is disposed on the pixel define layer; the organiclight emitting layer is disposed on the first electrode; the secondelectrode is disposed on the organic light emitting layer; and/or theencapsulation layer is disposed on the second electrode, and aprojection of the encapsulation layer on the base substrate covers theentire substrate.
 9. The display panel according to claim 7, whereineach sub-pixel further comprises the color film layer and anencapsulation layer, wherein the color film layer is disposed on theencapsulation layer; the display panel further comprises a touchstructure layer disposed between the encapsulation layer and the colorfilm layer, wherein the touch structure layer comprises a plurality oftouch electrodes, and an orthographic projection of the touch electrodeson the base substrate does not overlap with an orthographic projectionof the organic light emitting layer on the base substrate.
 10. Thedisplay panel according to claim 7, wherein a material of a retainingwall is an organic light shield material, the retaining wall is providedwith the first opening and forms the light shield part.
 11. The displaypanel according to claim 7, wherein a material of the firstplanarization layer is an organic light shield material, the firstplanarization layer is provided with the first opening, and forms thelight shield part.
 12. The display panel according to claim 7, whereinthe drive structure layer comprises a buffer layer, an active layer, afirst gate insulating layer, a first gate electrode layer, a second gateinsulating layer, a second gate electrode layer, a first interlayerinsulating layer, a first source-drain metal layer, a second interlayerinsulating layer and a second source-drain metal layer which aresequentially stacked on the base substrate, and the second source-drainmetal layer is provided with the first opening and forms the first lightshield layer.
 13. The display panel according to claim 7, wherein thedrive structure layer comprises a buffer layer, an active layer, a firstgate insulating layer, a first gate electrode layer, a second gateinsulating layer, a second gate electrode layer, a first interlayerinsulating layer and a first source-drain metal layer which aresequentially stacked on the base substrate, and the first light shieldlayer is disposed between the base substrate and the buffer layer. 14.The display panel according to claim 7, wherein the base substratecomprises a first base substrate and a second base substrate, and thefirst light shield layer is disposed between the first base substrateand the second base substrate; and/or a base film is disposed on asurface of the base substrate away from the drive structure layer, andthe fingerprint identification sensor is attached to a surface of thebase film away from the base substrate.
 15. The display panel accordingto claim 7, wherein the fingerprint identification sensor is disposedbetween the drive structure layer and the first planarization layer, andthe drive structure layer further comprises a second thin filmtransistor which is configured to turn on or off the fingerprintidentification sensor.
 16. The display panel according to claim 7,further comprising a filter layer disposed above the fingerprintidentification sensor and on a path where the fingerprint reflectedlight passes through the first opening to reach the fingerprintidentification sensor.
 17. The display panel according to claim 8,wherein the filter layer is disposed on the light transmission partbetween the color filters with different colors, or the spacer layercomprises a filter material with a first color as the filter layer, andthe filter material with the first color is configured to filter outlight that interferes with the fingerprint reflected light.
 18. Adisplay apparatus, comprising the display panel according to claim 1.19. A method for manufacturing a display substrate, comprising: forminga first light shield layer above the base substrate, wherein the firstlight shield layer comprises a first opening and a light shield part;forming a color film layer above the first light shield layer, whereinthe color film layer comprises color filters with different colors and alight transmission part disposed between the color filters withdifferent colors, the light transmission part and the first opening areconfigured to allow fingerprint reflected light to transmit and reach afingerprint identification sensor, and the light shield part isconfigured to block out stray light.
 20. The manufacturing methodaccording to claim 19, wherein forming the first light shield layerabove the base substrate comprises any one of the following: the basesubstrate comprising a first base substrate and a second base substrate,forming the first light shield layer on the first base substrate, andforming the second base substrate on a surface of the first light shieldlayer away from the first base substrate; forming a first light shieldlayer on the base substrate, and forming a pixel structure layer on thefirst light shield layer; forming a pixel structure layer on the basesubstrate, wherein the pixel structure layer comprises a buffer layer,an active layer, a first gate insulating layer, a first gate electrodelayer, a second gate insulating layer, a second gate insulating layer, afirst interlayer insulating layer, a first source-drain metal layer, asecond interlayer insulating layer and a second source-drain metal layerwhich are sequentially stacked on the base substrate, and the secondsource-drain metal layer forms the first light shield layer; forming apixel structure layer on the base substrate, forming a firstplanarization layer on a surface of the pixel structure layer away fromthe base substrate, forming a first electrode and a pixel define layeron a surface of the first planarization layer away from the pixelstructure layer, wherein the pixel define layer comprises a plurality ofopenings and retaining walls around the openings, the openings exposethe first electrode, and the retaining walls are provided with the firstopening, a material of the retaining walls is an organic light shieldmaterial, and the retaining walls form the first light shield layer;forming a pixel structure layer on the base substrate, and forming afirst planarization layer on a surface of the pixel structure layer awayfrom the base substrate, wherein the first planarization layer is madeof an organic light shield material, and the first planarization layeris provided with the first opening, and forms the first light shieldlayer.